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  • GPS L70
  • L70, a SMD type module, brings the high performance of the MTK positioning engine to the industrial applications with compact profile, ultra low power consumption and fast positioning capability.

    Combining advanced AGPS called EASY™ (Embedded Assist System) and proven AlwaysLocate™ technology, L70 achieves the highest performance and fully meets the industrial standard. EASY™ technology ensures L70 can calculate ...

    Quectel_L70_GPS_Specification_V2.2

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L70, a SMD type module, brings the high performance of the MTK positioning engine to the industrial applications with compact profile, ultra low power consumption and fast positioning capability.


Combining advanced AGPS called EASY™ (Embedded Assist System) and proven AlwaysLocate™ technology, L70 achieves the highest performance and fully meets the industrial standard. EASY™  technology ensures L70 can calculate and predict orbits automatically using the ephemeris data (up to 3 days) stored in internal flash memory, so L70 can fix position quickly even at indoor signal levels with low power consumption. With AlwaysLocate™ technology, L70 can adaptively adjust the on/off time to achieve balance between positioning accuracy and power consumption according to the environmental and motion conditions.


Additional feature of embedded logger function called LOCUS allows L70 to log position information to internal flash memory at default intervals of 15 seconds and provide typically more than 16 hours log capacity without adding cost.

 

The Fitness Low Power (FLP) feature provides low power GPS solution for fitness application. It is an optimized solution for wearable, fitness and tracking device and only costs 5mA current consumption in static receiving.


With its tiny design, high precision and sensitivity, L70 is perfectly suitable for a broad range of M2M applications such as portable device, automotive, personal tracking, security and industrial PDA.

 

Key benefits   

●  Extremely compact size: 10.1 × 9.7 × 2.5 mm

●  EASY™, advanced AGPS technology without the need for external memory

●  Ultra low power consumption in tracking mode, 18mA

●  AlwaysLocate™, an intelligent controller of periodic mode

●  LOCUS, innate logger solution with no need for host and external flash

●  Highly sensitivity, -165dBm@Tracking, -148dBm@Acquisition

●  66 acquisition channels, 22 tracking channels

●  FLP mode, only 5mA in static receiving

●  Balloon mode, for high altitude up to 80km

●  Support QZSS

●  Support DGPS, SBAS(WAAS/EGNOS/MSAS/GAGAN)

●  Anti-Jamming, Multi-tone Active Interference Canceller

●  PPS VS. NMEA can be used in time service

●  Support SDK command developed by Quectel

 

 

 

General Specifications
  L1 Band Receiver
(1575.42MHz)
Channel Number 22 (tracking) / 66 (acquisition)
  C/A Code  
  SBAS WAAS, EGNOS, MSAS,GAGAN
  Horizontal Position
Accuracy
Autonomous <2.5m CEP
  Velocity Accuracy Without Aid < 0.1m/s
  Acceleration Accuracy Without Aid 0.1 m/s2
  Timing Accuracy 1PPS out 10ns

 

Reacquisition Time

  <1s
  TTFF@-130dBm
with EASYTM
Cold Start <15s
  Warm Start <5s
  Hot Start <1s
  TTFF@-130dBm
without EASYTM
Cold Start <35s
  Warm Start <30s
  Hot Start <1s
  Sensitivity Acquisition -148dBm
  Tracking -165dBm
  Reacquisition -160dBm
  Environmental Operating Temperature -40℃ to 85℃
    Storage Temperature -45℃ to 125℃
  Dynamic Performance Maximum Altitude Max.18000m
  Maximum Velocity Max.515m/s
  Maximum Acceleration 4G
  Dimensions 10.1 × 9.7 × 2.5mm
  Weight Approx. 0.6g
     
Serial Interfaces
  Serial Interfaces UART: Adjustable 4800~115200 bps
Default: 9600bps
  Update Rate 1Hz (default), up to10Hz
  I/O Voltage 2.7V ~ 2.9V
  Protocols NMEA 0183
PMTK
     
Power Management
  Power Supply 2.8V ~ 4.3V
  Power Acquisition 18mA
  Power Tracking 12mA
  Power Saving Typ. 1.4mA@AlwaysLocateTM
    7uA@Backup Mode
    200uA@Standby Mode
    Periodic Mode
  Antenna Type Active or Passive
  Antenna Power External or Internal VCC_RF
     
Certifications
  CE/ FCC  

 

 

The module is sensitivity to moisture absorption. Before reflow, Module should be baked for 192 hours at temperature 40℃+5℃/-0℃ and <5% RH in low-temperature containers, or 24 hours at temperature 125℃±5℃ in high-temperature containers. Care should be taken that plastic tray is not heat resistant. Module should be taken out before preheating, otherwise, the tray maybe damaged by high-temperature heating.