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  • Wi-Fi FC10
  • Quectel FC10 is an innovative embedded Wi-Fi wireless solution providing high performance connectivity capabilities with low cost. Designed with ultra-compact 16.6×13.0×2.1mm form factor, FC10 module can effectively optimize size and cost for end-products, which totally meets the customer requirements on size sensitive applications to the maximum extent.

    FC10 adopts surface mounted technology (SMT), making it the ideal solution for durable and rugged designs.

    Quectel_FC10_Wi-Fi_Specification_V1.0.pdf

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Quectel FC10 is an innovative embedded Wi-Fi wireless solution providing high performance connectivity capabilities with low cost. Designed with ultra-compact 16.6×13.0×2.1mm form factor, FC10 module can effectively optimize size and cost for end-products, which totally meets the customer requirements on size sensitive applications to the maximum extent.
 
FC10 adopts surface mounted technology (SMT), making it the ideal solution for durable and rugged designs. Its low profile and small size of LCC package ensure FC10 easily embedded into the low-volume applications and provide the reliable connectivity with the applications. Meanwhile, this advanced package allows fully large-scale automated manufacturing which has the strict requirements for cost and efficiency.
 
Additionally, it can also be manually soldered in small unit manufacturing.Combined with Quectel EC20 LTE module, its compact form factor, low power consumption, extended temperature range and stable SDIO I/O make FC10 the best choice for applications such as automotive, security, industrial PDA, MIFI, medical and other M2M applications.
 
 

Key Benefits

● Ultra compact Wi-Fi module

● Easier soldering and testing process with LCC package

● Stable and reliable SDIO communication I/O
● Support IEEE802.11b/g/n standard
● Fast time-to-market: simple design minimizes design-in time and development efforts

 

 

General Features
  Frequency Range 2.4~2.4835GHz
  WLAN Standard 802.11b/g/n
  Channel Number 14

 

Modulation Mode

DBPSK, DQPSK, BPSK, QPSK, 16QAM,
64QAM
  Encryption Mode WEP, TKIP,AES,WPA-PSK,WPA2-PSK

 

AP (Max Access Point)

10
  Supply Voltage Range 3.14~3.46V, 3.3V Typ.
  Operation Temperature -40 °C ~ +85 °C
  Dimension 16.6 × 13.0 × 2.1mm
  Weight About 0.63g
     
Data Transmission
  802.11b Max 11Mbps
  802.11g Max 54Mbps
  802.11n Max 65Mbps
     
Electrical Characteristics
  Receiving Sensitivity -93dBm @802.11b/1Mbps
-85dBm @802.11b/11Mbps
-89dBm @802.11g/6Mbps
-72dBm @802.11g/54Mbps
-90dBm @802.11n/HT20 MCS0
-69dBm @802.11n/HT20 MCS7
  Transmitting Power 13 dBm @802.11b/11Mbps
12.5dBm @802.11g/6Mbps
9.5dBm @802.11g/54Mbps
10dBm @802.11n/HT20 MCS0
6 dBm @802.11n/HT20 MCS7
     
I/O
  SDIO 1(SDIO V2.0)
  Reset 1
  Antenna 1(Wi-Fi antenna)
     
 

 

 

 

 


Quectel modules are shipped in tape and reel forms and are hermetically sealed with desiccant and humidity indicator card. The tape is packed in a vacuum-sealed bag which is ESD protected and comes with detailed care instructions about moisture sensitivity.

 

Application Note

Hardware Design

EVB Kit

Certificate